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Leave it to us when it comes to double-sided grinding machines.
We have received high praise from customers in various fields for our grinding, polishing, cutting, and have developed technologies related to fine grinding, wrapping and polishing equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid trust.
Achieving double-sided grinding of SiC! Double-sided grinding processing.
In power devices such as SiC (silicon carbide) and GaN (gallium nitride), which are expected to see market expansion in the future, cost reduction is an important issue. Among these, we would like to introduce a processing case that achieved cost reduction through a method different from conventional processing processes. [Polishing Results] ■ Surface roughness < 0.5nm (subsequent process CMP) ■ TTV < 2μm / Warp < 10μm ■ Achieved double-sided grinding of SiC by using the high-speed pressure grinding machine 'EJD-6BY' and the fixed grinding stone 'MAD Plate'. *For more details, please refer to the PDF document or feel free to contact us.
